Product Flat Grinding Solution
Solution Desperation：
FPM-380/380-P plane polishing machine is a surface grinding and polishing device for products
made of FA fiber arrays, crystals, ceramics, metal, glass, etc. It is widely used in the optoelectronic
industry for component grinding and polishing and in the abrasive industry for comparative
analysis and verification of grinding data. The machine is equipped with Φ380mm grinding and
polishing disc and three ceramic ring processing stations, which can be used for grinding and
polishing round pieces with diameter ≤ Φ152mm or rectangular planes with diagonal length
≤ 152mm.
Product Advantages：
> There are three machining stations, and the grinding fixture can be optional counterweight or
self-weight pressurized;
> Roughness of processed parts ≤ Ra0.32μm, flatness ≤ 0.003mm, ensuring the stability of batch
processing of high precision flat surfaces;
> Adopting cylinder fixture, the grinding pressure can be adjusted, the grinding timer can be set
arbitrarily within the range of 0s-99h, and the time can be accumulated;
> Optional automatic drip feeder or circulation system, so that the abrasive evenly sprayed on the
grinding disc, processing workpiece yield is higher;
> After polishing, the surface of the workpiece has high brightness, no scratches, no grain, no
pockmarks, no collapsed edges, and high flatness;
> FPM-380-P with sanding disc plane trimming function, suitable for rough grinding and polishing;
> FPM-380 without sanding disc plane dressing function, suitable for polishing only;
> The simple structure of the grinding unit and the grinding machine makes it suitable for the
manual production of single pieces as well as for the mechanized production of batches at the
same time;
> High-quality mechanical parts and electrical components to ensure the stability and reliability
of the equipment.
Applications:
> Widely used for flat or cylindrical polishing of precision hardware, ceramics and glass products;
> Used for flat surface polishing of FA fiber arrays, glass capillaries, small wafers, silicon wafers,
germanium wafers, molds and light guides.
